{
  "cml": {
    "alternative": {
      "candidates": [],
      "oem_replacement_status": "OEM_REPLACEMENT_NOT_LISTED"
    },
    "counter_evidence": "A later public Amphenol EOL list appears to include the same MPN under PCN 26043 with a different effective date. This may be an overlapping notice or later schedule and must be reconciled with Amphenol before procurement action.",
    "decision": {
      "claim_type": "DECISION_RECOMMENDATION",
      "current_recommendation": "Confirm remaining demand before the stated LTB boundary and begin a scope-bound second-source or redesign qualification. No qualified substitute is established.",
      "supported_paths": [
        "LIFETIME_BUY",
        "QUALIFY_SECOND_SOURCE",
        "REDESIGN"
      ]
    },
    "dependency": {
      "client_scope": "NOT_PROVIDED",
      "context": "Existing PCB footprint, mating half, contact geometry, plating and electrical loading may constrain migration."
    },
    "event": {
      "created_at": "2026-09-16T00:00:00Z",
      "detail": "PCN 26 027 lists the part in an end-of-life action with last-time buy 2026-09-15 and last shipment 2027-09-15.",
      "effective_at": "2027-03-15T00:00:00Z",
      "event_domain": "SUBJECT_EVENT",
      "event_id": "SE.CML.EVENT.AMPHENOL.PCN-26-027.10081811-101-07LF",
      "event_type": "EOL_DECLARED",
      "known_at": "2026-03-16T00:00:00Z",
      "source_refs": [
        "AMPHENOL_PCN_26027"
      ],
      "technical_item_id": "SE.TECH.AMPHENOL.10081811-101-07LF",
      "verification_status": "PRIMARY_SOURCE_REVIEWED"
    },
    "evidence": {
      "known_facts": [
        "SOURCE_FACT: PCN 26 027 lists four affected BERGSTIK part numbers, including the exact MPN.",
        "SOURCE_FACT: Last-time buy is 2026-09-15; effective change is 2027-03-15; last shipment is 2027-09-15.",
        "SOURCE_FACT: The available-alternatives field is blank in the reviewed notice."
      ],
      "source_register_id": "SE.CML.RECORD.AMPHENOL.10081811-101-07LF.v0.1.sources",
      "unknowns": [
        "An OEM-approved replacement is not established by the reviewed evidence.",
        "Exact footprint, mating and plating equivalence for any third-party candidate is not established.",
        "A second Amphenol EOL listing with a different effective date requires manufacturer clarification."
      ]
    },
    "freshness_reason": "CONFLICTING_PRIMARY_LIFECYCLE_EFFECTIVE_DATE",
    "freshness_rule_type": "EVENT_DRIVEN",
    "freshness_state": "CURRENT_WITH_LIMITATIONS",
    "identity": {
      "created_at": "2026-09-16T00:00:00Z",
      "datasheet_refs": [
        "AMPHENOL_PCN_26027"
      ],
      "description": "Right-angle single-row BERGSTIK board header; exact drawing attributes remain only partially established in reviewed primary evidence.",
      "manufacturer": "Amphenol Communications Solutions",
      "manufacturer_normalized": "AMPHENOL_COMMUNICATIONS_SOLUTIONS",
      "manufacturer_part_number": "10081811-101-07LF",
      "manufacturer_part_number_exact": "10081811-101-07LF",
      "manufacturer_product_url": null,
      "nominal_application_class": "Board interconnect",
      "package_or_interface": "2.54 mm board-header class; footprint verification required",
      "part_number_normalized": "10081811-101-07LF",
      "product_family": "HPL-578 BERGSTIK",
      "record_version": "CML_v0.1",
      "technical_item_id": "SE.TECH.AMPHENOL.10081811-101-07LF",
      "technical_item_type": "CONNECTOR"
    },
    "lifecycle_state": "EOL_ANNOUNCED",
    "product_context": "PUBLIC_TECHNICAL_RECORD",
    "public_private_boundary": "PUBLIC_EVIDENCE_ONLY_NO_CLIENT_BOM",
    "verification": {
      "compatibility_matrix": [
        {
          "dimension": "MECHANICAL",
          "evidence_or_test": "Drawing and dimensional inspection",
          "state": "REQUIRES_TEST"
        },
        {
          "dimension": "PINOUT",
          "evidence_or_test": "PCB footprint and row geometry comparison",
          "state": "UNKNOWN"
        },
        {
          "dimension": "ELECTRICAL",
          "evidence_or_test": "Current, resistance and dielectric tests",
          "state": "REQUIRES_TEST"
        },
        {
          "dimension": "MATERIAL",
          "evidence_or_test": "Contact material and plating stack",
          "state": "UNKNOWN"
        },
        {
          "dimension": "ENVIRONMENTAL",
          "evidence_or_test": "Thermal cycling and solderability",
          "state": "REQUIRES_TEST"
        },
        {
          "dimension": "RELIABILITY",
          "evidence_or_test": "Insertion, retention and mating-cycle scope",
          "state": "REQUIRES_TEST"
        }
      ],
      "qualification_state": "LAB_VERIFICATION_REQUIRED",
      "requirements": [
        "Mechanical drawing comparison",
        "PCB footprint inspection",
        "Contact resistance",
        "Insulation resistance",
        "Dielectric withstand",
        "Solderability",
        "Insertion and retention force",
        "Thermal cycling",
        "Mating compatibility"
      ]
    }
  },
  "core": {
    "artifact_refs": [
      "AMPHENOL_PCN_26027:1de0af0411ad1c5b4098877cef46b3c4d99a9168f6bf778ac7a7d602c6d4ac87"
    ],
    "core_version": "STRUCTEVIDENCE_EVIDENCE_CORE_v0.1",
    "correction_status": "NO_CORRECTION_RECORDED",
    "created_at": "2026-09-16T00:00:00Z",
    "domain": "TECHNICAL_RISK",
    "effective_at": "2027-03-15T00:00:00Z",
    "input_hash": "431fdad74a86eb4c8963532d62479aa420743f9ad60a0875828409651c2c2051",
    "known_at": "2026-03-16T00:00:00Z",
    "policy_version": "RDL_FRESHNESS_v0.1a+CML_PROFILE_v0.1",
    "protocol": "CML",
    "record_hash": "e665909621d08fe0c1049a1a09775d69e101856ed3b9305c500f887e8c2af51f",
    "record_id": "SE.CML.RECORD.AMPHENOL.10081811-101-07LF.v0.1",
    "source_refs": [
      "AMPHENOL_PCN_26027"
    ],
    "subject_class": "TECHNICAL_ITEM",
    "subject_id": "SE.TECH.AMPHENOL.10081811-101-07LF",
    "supersession_status": "CURRENT",
    "updated_at": "2026-09-16T00:00:00Z",
    "verification_status": "REVIEWED_WITH_LIMITATIONS"
  }
}